ASTM D4321-2009

塑料薄膜包装屈服度试验方法

Standard Test Method for Package Yield of Plastic Film

适用范围：<p>Actual yield is important to the film converter as this determines the actual number of units or packages that he can derive in a particular conversion from any given mass of film.</p><p id="s00002"...

实施日期：2009-02-01

ASTM D4321-2015

Standard Test Method For Package Yield Of Plastic Film

实施日期：2015-05-01

ASTM F1140/F1140M-2013

Standard Test Methods for Internal Pressurization Failure Resistance of Unrestrained Packages

ASTM F2054-2007(2012)

用约束板内部气体加压法测试密封包装的破裂试验

Standard Test Method for Burst Testing of Flexible Package Seals Using Internal Air Pressurization Within Restraining Plates

实施日期：2007-08-01

ASTM D6881/D6881M-2003(2013)

用容积密度分类的标准塑料行业散装箱/货盘单件尺寸的分级

Standard Classification for Standard Plastics Industry Bulk Box/Pallet Unit Size Classified By Bulk Density

发布日期：2013-10-01  实施日期：2013-10-01

ASTM D6344-2004(2009)

运输包装集中撞击的试验方法

Standard Test Method for Concentrated Impacts to Transport Packages

适用范围：<p>This test method is intended to evaluate the ability of packaging to resist the force of concentrated impacts from outside sources, such as those encountered in various modes of transportation and h...

实施日期：2004-08-01

ASTM D6633-2005(2010)

Standard Test Method for Basic Functional Stability of a Mechanical Pump Dispenser

ASTM E2230-2008

放射性材料用B类包装的热鉴定规程

Standard Practice for Thermal Qualification of Type B Packages for Radioactive Material

适用范围：<p>The major objective of this practice is to provide a common reference document for both applicants and certification authorities on the accepted practices for accomplishing package thermal qualifica...

实施日期：2008-08-01

ASTM D3951-2015

Standard Practice for Commercial Packaging

发布日期：2015-12-01  实施日期：2015-12-01

NF C96-013-6-21-2011

Mechanical standardization of semiconductor devices - Part 6-21 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small o

ASTM F2338-2009(2013)

Standard Test Method for Nondestructive Detection of Leaks in Packages by Vacuum Decay Method

实施日期：2009-01-01

ASTM D2243-1995(2008)

水溶性涂料抗冻融性试验方法

Standard Test Method for Freeze-Thaw Resistance of Water-Borne Coatings

适用范围：<p>When water-borne coatings are shipped during cold weather, they may experience cycles of freezing and thawing. Cycles of freezing and thawing cause more damage to water-borne coatings than when t...

实施日期：1995-08-15

ASTM D3103-2007e1

销售包装绝热性试验方法

Standard Test Method for Thermal Insulation Performance of Distribution Packages

ASTM E171/E171M-2011

柔性阻隔包装材料调节和测试规程

Standard Practice for Conditioning and Testing Flexible Barrier Packaging

适用范围：<p>Conditioning is used to minimize the variation in test results that may result from fluctuations in temperature and humidity, or both. Many flexible packaging materials or components of flexible pac...

实施日期：2011-11-15

NF C96-013-6-12-2012

Mechanical standardization of semiconductor devices - Part 6-12 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA).

ASTM D6911-2003(2010)

实验室分析用环境试样的包装与装运指南

Standard Guide for Packaging and Shipping Environmental Samples for Laboratory Analysis

实施日期：2003-07-10

ASTM D3103-2014

销售包装绝热性试验方法

Standard Test Method for Thermal Insulation Performance of Distribution Packages

适用范围：This test method is intended for use for evaluating the performance of thermal insulated packaging used for high-value, high-risk materials. This test method may also be used for any product that requi...

发布日期：2014-10-01  实施日期：2014-12-01

ASTM F2217-2002(2007)

敷层/粘合剂重量测定规程

Standard Practice for Coating/Adhesive Weight Determination

适用范围：<p id="s00021">Coating weight is an indicator of certain functional characteristics of coated substrates (for example, sealability, peelability, appearance). The methodology described in this practice ...

实施日期：2002-12-10

BS EN 60191-6-22-2013

半导体器件的器械标准化:表面安装半导体器件封装外形图绘制的一般规则

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Sili...

发布日期：2013-04-30  实施日期：2013-04-30

ASTM F2096-2011

通过内部加压(鼓泡试验)检测医用包装总泄漏量的标准试验方法

Standard Test Method for Detecting Gross Leaks in Packaging by Internal Pressurization (Bubble Test)

适用范围：The internal pressurization test method provides a practical way to examine packages for gross leaks.

实施日期：2011-12-15