Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad bas...
发布日期:1995-11-28 实施日期:1995-11-28
Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of def...
发布日期:2005-09-05 实施日期:2005-09-05
Materials for printed boards and other interconnecting structures. Part 2-39:Reinforced base materials clad and unclad. High performance epoxide and non-epoxide,woven E-glass laminate sheets of defined...
实施日期:2012-11-29
Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined fla...
发布日期:2005-01-11 实施日期:2005-01-11
Test methods for electrical materials,printed boards and other interconnection structures and assemblies. Part 3-913:Test methods for interconnection structures (printed boards). Electronic circuit boa...
发布日期:2011-01-31 实施日期:2011-01-31
Materials for printed boards and other interconnecting structures. Part 2-41:Reinforced base materials clad and unclad. Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of de...
发布日期:2010-04-21 实施日期:2010-04-21
Guide for the evaluation of the remaining life of impregnated paper-insulated transmission cable systems
实施日期:2001-12-01
Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non- halogenated phenolic cellulose paper reinforced laminated sheets, econom...
实施日期:2005-08-01
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (verti...
发布日期:2008-11-27 实施日期:2008-11-27
Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards); adhesi...
实施日期:1999-11-01
Materials for printed boards and other interconnecting structures. Part 2-42:Reinforced base materials clad and unclad. Brominated epoxide non-woven/woven E-glass reinforced laminate sheets of defined ...
发布日期:2010-04-21 实施日期:2010-04-21
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (verti...
实施日期:2009-07-01
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