Gurtung und Magazinierung von Bauelementen für automatische Verarbeitung. Gurtung von Bauelementen mit einseitig herausgeführten Anschlüssen Packaging of components for automatic handling-Part 2:Packag...
实施日期：2009-03-31
Passive LWL-Bauelemente und konfektionierte LWL-Kabel. Befaehigungsanerkennung. Fachgrundspezifikation Fibre Optic Passive Components and Cable Assemblies Part 1:Capability Approval-Generic Specificati...
实施日期：1997-08-15
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method
实施日期：2008-10-01
Klassifizierung von Umweltbedingungen. Klassen von Umwelteinflussgroessen und deren Grenzwerte. Einsatz an und in Landfahrzeugen Classification of Environmental Conditions Part 3:Classification of Grou...
实施日期：1997-08-15
Sectional specification: Radio frequency coaxial connectors; series SSMB; German version EN 122170:1993
Discrete semiconductor devices and integrated circuits - Part 5-3: Optoelectronic devices - Measuring methods
发布日期：1997-09-05 实施日期：1997-09-05
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad bas...
发布日期：1995-11-28 实施日期：1995-11-28
Fixed resistors for use in electronic equipment Part 6: Sectional specification: Fixed resistor networks with individually measurable resistors
Standard data elements types with associated classification scheme for electric items. Part 1:Definitions. Principles and methods Types normalisés d"éléments de données avec plan de classification pour...
发布日期：2009-07-30 实施日期：2009-07-01
Verfahren fuer die Volumenmessung von fluessigen Kohlenwasserstoffen. Turbinendurchflusszaehler-Systeme Volumetric Measurement of Liquid Hydrocarbons Part 2:Turbine Meter Systems Methode de mesurage vo...
实施日期：1984-01-01
发布日期：2013-02-06 实施日期：2013-02-06
Inspection methods for basic parameters of Environmental testing equipments for electric and electronic products Combined sequential cold low air pressure And damp heat testing equipments
发布日期：2005-08-26 实施日期：2006-04-01
Semiconductor Devices. Mechanical and Climatic Test Methods. Part 2:Low Air Pressure CORRIGENDUM 1
实施日期：2003-08-01
Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of def...
发布日期：2005-09-05 实施日期：2005-09-05
Connectors for use in d.c. low-frequency analogue and digital high speed data applications - Part 4-103: Printed board connectors with assessed quality - Detail specification for two-part connectors wi...
发布日期：1999-02-26 实施日期：1999-02-26
发布日期：2012-10-12 实施日期：2012-10-12
Semiconductor Devices. Mechanical and Climatic Test Methods. Part 12:Vibration,Variable Frequency Dispositifs A Semiconducteurs. Methodes D′essais Mecaniques et Climatiques. Partie 12:Vibrations,Freque...
实施日期：2002-04-01
Fibre optic interconnecting devices and passive components - Fibre optic connector interfaces - Part 28: Type LF3 connector family
发布日期：2012-05-15 实施日期：2012-05-15
发布日期：2012-05-31
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