Aerospace series. Weldability and brazeability of materials in aerospace constructions. Part 004:Welding and brazing of homogeneous assemblies of high alloyed steels
实施日期:2012-09-01
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
适用范围:This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of discrete electronic components.
实施日期:2004-05-01
发布日期:2013-11-01 实施日期:2013-11-01
Compressors and vacuum pumps. Safety requirements. Part 1:Air compressors
发布日期:2010-09-01 实施日期:2010-09-01
Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
适用范围:This part of IEC 61192 specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surfac...
实施日期:2003-10-01
Anforderungen an die Ausfuehrungsqualitaet von Loetbaugruppen. Baugruppen in Durchsteckmontage Workmanship requirements for soldered electronic assemblies Part 3:Through-hole mount assemblies Exigences...
适用范围:This part of IEC 61192 specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surfac...
实施日期:2003-04-07
WROUGHT COPPER AND COPPER ALLOY SOLDER-JOINT PRESSURE FITTINGS
实施日期:2013-09-25
实施日期:2009-07-31
Spezifikation fuer guetebestaetigte Transformatoren und Induktoren nach Kundenspezifikation:Allgemeine Daten und Pruefmethoden Specification for Custom-built transformers and inductors of assessed qual...
适用范围:Lists the test methods that are used in the test schedules for the assessment and maintenance of capability approval; and selected for inclusion in customers' detail specifications. Also gives marking ...
实施日期:1989-10-31
Workmanship requirements for soldered electronic assemblies - Part 1: General
适用范围:This part of IEC 61192 specifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrates.
实施日期:2003-11-01
Anforderungen an die Ausfuehrungsqualitaet von Loetbaugruppen. Baugruppen in Oberflaechenmontage Workmanship requirements for soldered electronic assemblies Part 2:Surface-mount assemblies Exigences re...
适用范围:This part of IEC 61192 specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates ...
实施日期:2003-06-25
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