EN 62047-6-2010

Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials

NF C96-050-6-2010

Semiconductor devices - Micro-electromechanical devices - Part 6 : axial fatigue testing methods of thin film materials.

ISO 12111-2011

金属材料 疲劳试验 应变控制的热机械疲劳试验方法

Metallic materials -- Fatigue testing -- Strain-controlled thermomechanical fatigue testing method

适用范围：ISO 12111:2011 is applicable to the TMF (thermomechanical fatigue) testing of uniaxially loaded metallic specimens under strain control. Specifications allow for any constant cyclic amplitude of mechan...

发布日期：2011-08-01  实施日期：2011-08-01

BS ISO 12111-2011

Metallic materials. Fatigue testing. Strain-controlled thermomechanical fatigue testing method

实施日期：2011-10-31

IEC 62047-12-2011

半导体器件 微电机器件 第12部分:用微电机系统结构谐振进行薄膜材料的弯曲疲劳试验方法

Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

适用范围：IEC 62047-12:2011 specifies a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines. This standard ...

发布日期：2011-09-13  实施日期：2011-09-13

BS EN 62047-12-2011

Semiconductor devices. Micro-electromechanical devices. Part 12:Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

实施日期：2011-11-30

BS ISO 4548-7-2012

内燃机全流式机油滤清器试验方法 振动疲劳试验

Methods of test for full-flow lubricating oil filters for internal combustion engines. Vibration fatigue test

发布日期：2012-11-30  实施日期：2012-11-30

DIN EN 62047-6-2010

半导体器件 微电机器件 第6部分:薄膜材料的轴向疲劳试验方法

Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009); German version EN 62047-6:2010

实施日期：2010-07-01

NF C96-050-12-2012

Semiconductor devices - Micro-electromechanical devices - Part 12 : bending fatigue testing method of thin film materials using resonant vibration of MEMS structures.