IEC 61191-2-2013

印制电路板组件 第2部分:分规范 表面安装焊接组件的要求

Printed board assemblies. Part 2:Sectional specification. Requirements for surface mount soldered assemblies

发布日期：2013-06-05  实施日期：2013-06-05

BS EN 60068-2-83-2011

Umweltprüfungen. Prüfungen. Prüfung Tf. Prüfung der L?tbarkeit von Bauelementen der Elektronik für Oberfl?chenmontage (SMD) mit der Benetzungswaage unter Verwendung von Lotpaste Environmental testing Part 2-83:Tests. Test Tf:Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste Essais d'environnement. Essais. Essais Tf. Essai de brasabilit. des composants électroniques pour les composants pour montage en surface (CMS) p

实施日期：2011-11-30

IEC 60068-3-13-2016

Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering

发布日期：2016-05-13  实施日期：2016-05-13

IEC/TR 60068-3-12-2014

环境试验 第3-12部分:支持文件和指南 评估可能发生的无铅焊料回流温度曲线方法

Environmental testing. Part 3-12:Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile

发布日期：2014-10-17  实施日期：2014-10-17

NF C20-783-2012

Environmental testing - Part 2-83 : tests - Test Tf : solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste.

IEC 60068-2-83-2011

环境试验 第2-83部分:试验 试验 Tf:表面贴装器件(SMD)的电子元件使用焊膏润湿平衡方法的可焊性测试

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

发布日期：2011-09-07  实施日期：2011-09-07

BS EN 61191-2-2013

印制电路板组件 分规范 表面安装焊接组件要求

Printed board assemblies. Sectional specification. Requirements for surface mount soldered assemblies

发布日期：2013-10-31  实施日期：2013-10-31

EN 60068-2-83-2011

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

发布日期：2011-10-12  实施日期：2011-10-12

IEC 61189-5-3-2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

发布日期：2015-01-08  实施日期：2015-01-08

IEC 61190-1-2-2014

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

发布日期：2014-02-19  实施日期：2014-02-19