IEC 62047-10-2011

半导体器件 微电机器件 第10部分:MEMS材料的微柱压缩试验

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

适用范围：IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The ...

发布日期：2011-07-26  实施日期：2011-07-26

DIN EN 62047-4-2011

Semiconductor devices. Micro-electromechanical devices. Part 4:Generic specification for MEMS (IEC 62047-4:2008); German version EN 62047-4:2010

EN 62047-6-2010

Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials

NF C96-050-6-2010

Semiconductor devices - Micro-electromechanical devices - Part 6 : axial fatigue testing methods of thin film materials.

DIN EN 62047-8-2011

半导体器件 微电机器件 第8部分：测量薄膜拉伸性能的带弯曲试验方法

Semiconductor devices. Micro-electromechanical devices. Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011); German version EN 62047-8:2011

IEC/TS 62607-5-1-2014

纳米加工 关键控制特 第5-1部分:薄膜有机/纳米电子设备 载体运输测量

Nanomanufacturing. Key control characteristics. Part 5-1:Thin-film organic/nano electronic devices. Carrier transport measurements

适用范围：IEC TS 62607-5-1:2014(E) provides a standardized sample structure for characterizing charge transport properties in thin-film organic/nano electronic devices and a format to report details of the struc...

发布日期：2014-09-03  实施日期：2014-09-03

UL 61646-2012

UL Standard for Safety Thin-Film Terrestrial Photovoltaic (PV) Modules ?Design Qualification and Type Approval First Edition

实施日期：2012-01-25

IEC 62047-21-2014

Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson''s ratio of thin film MEMS materials

发布日期：2014-06-19  实施日期：2014-06-19

IEC 62716-2013

Photovoltaic (PV) modules - Ammonia corrosion testing

发布日期：2013-06-27  实施日期：2013-06-27

IEC 62047-22-2014

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

发布日期：2014-06-19  实施日期：2014-06-19

NF C96-050-8-2011

Semiconductor devices - Micro-electromechanical devices - Part 8 : strip bending test method for tensile property measurement of thin films.

BS EN 62047-11-2013

半导体装置 微机电设备 独立材料材料的微机电系统线性热膨胀系数测定方法

Semiconductor devices. Micro-electromechanical devicesTest method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems

发布日期：2013-10-31  实施日期：2013-10-31

IEC/TS 62607-4-3-2015

纳米制造 关键控制特性 第4-3部分:纳米电能存储 纳米材料的联系和涂层电阻率测量

Nanomanufacturing. Key control characteristics. Part 4-3:Nano-enabled electrical energy storage. Contact and coating resistivity measurements for nanomaterials

适用范围：This part of IEC 62607 provides a standardized test method for the measurement of contact and coating resistivity of nano-enabled electrode materials. This method will enable a customer to: a) decide w...

实施日期：2015-08-18

IEC 62047-12-2011

半导体器件 微电机器件 第12部分:用微电机系统结构谐振进行薄膜材料的弯曲疲劳试验方法

Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

适用范围：IEC 62047-12:2011 specifies a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines. This standard ...

发布日期：2011-09-13  实施日期：2011-09-13

BS EN 62047-12-2011

Semiconductor devices. Micro-electromechanical devices. Part 12:Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

实施日期：2011-11-30

BS EN 62047-10-2011

Halbleiterbauelemente. Bauelemente der Mikrosystemtechnik. Druckprüfverfahren an zylinderf?rmigen Mikroproben für Werkstoffe der Mikrosystemtechnik Semiconductor devices. Micro-electromechanical devices Part 10:Micro-pillar compression test for MEMS materials Dispositifs. semiconducteur. Dispositifs microélectromécaniques. Essai de compression utilisant la technique des micro-piliers pour les matériaux des MEMS

实施日期：2011-09-30

NF C96-050-4-2011

Semiconductor devices - Micro-electromechanical devices - Part 4 : generic specifications for MEMS.

DIN EN 62047-10-2012

半导体器件 微电机器件 第1部分：微电机系统材料的微柱压缩试验

Semiconductor devices. Micro-electromechanical devices. Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011); German version EN 62047-10:2011

ISO/TTA 4-2002

硅基质上薄膜导热性的测量

Measurement of thermal conductivity of thin films on silicon substrates

适用范围：TTA 4:2002 proposes a standard procedure for the three-omega method for measuring the thermal conductivity of a thin, electrically insulating film, on a substrate having a thermal conductivity signific...

发布日期：2002-11-01  实施日期：2002-11-01

IEC 62047-17-2015

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films

发布日期：2015-03-05  实施日期：2015-03-05