DIN IEC 91/160/CD-1999

Printed board assemblies - Part 4: Sectional specification: Workmanship requirements for terminal soldered assembly (IEC 91/160/CD:1998)

DIN IEC 60326-11-1993

印制电路板.第11部分:带贯穿连接的刚性弯曲多层印制电路板要求

Printed boards; part 11: specification for flex-rigid multilayer printed boards with through connections; identical with IEC 60326-11:1991

GB/T 2036-1994

印制电路术语

Terms for printed circuits

适用范围：本标准规定了印制电路技术的常用术语及其定义。　　本标准适用于印制电路用基材、印制电路设计与制造、检测与印制板装联及有关领域。

发布日期：1994-12-28  实施日期：1995-08-01

JIS C 6485-2008

Base materials for printed circuits -- Paper base, phenolic resin

发布日期：2008-08-20  实施日期：2008-08-20

IEC 61182-7-1995/COR1-2002

Corrigendum 1 - Printed boards - Electronic data description and transfer - Part 7: Bare board electrical test information in digital form

发布日期：2002-10-15  实施日期：2002-10-15

DIN EN 61249-5-4-1997

互连结构的材料.第5部分:带或不带涂层的导电箔或膜的分规范 第4节:导电墨

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings; section 4: Conductive inks (IEC 61249-5-4:1996); German version E...

适用范围：This document describes those factors which control the flatness of rigid printed boards and their assemblies.

NF EN 61193-1-2002

Quality assessment systems - Part 1 : registration and analysis of defects on printed board assemblies.

实施日期：2002-08-01

NF EN 60249-2-18/A1/A2-1996

NF EN 60249-2-18-1994的修改件1

KS C6065-1990

印刷配线板用语

Glossary of Terms Related to Printed Wiring Boards

DIN EN 61191-6-2011

印制板组装 第6部分:BGA与LGA焊接接头中空隙的评定准则和测量方法

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method (IEC 61191-6:2010); German version EN 61191-6:2010

实施日期：2011-01-01

BS 123600-2001

质量评估体系 分规范 贯穿连接的软-硬性多层印制板

System of Quality Assessment-Sectional Specification-Flex-Rigid Multilayer Printed Boards with Through-Connections

适用范围：To be read in conjunction with BS 123000:2001

实施日期：2001-12-17

NF C93-780-2-4-2002

Materials for printed boards and other interconnecting structures - Part 2-4 : reinforced base materials clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad.

DIN EN 61188-5-3-2008

印制电路板和印制电路板组件 设计和使用 第5-3部分:连接(连接面/接头)考虑事项 两侧带有鸥翼形引线的元件

Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides

实施日期：2008-07-01

GB 4588.2-1984

有金属化孔的单,双面印制板技术条件

实施日期：1985-05-01

NF EN 60249-2-16/A3-2001

印刷电路用基材.第2部分:规范.16号规范:规定易燃性的聚酰亚胺机织玻璃纤维织物包铜层压板(垂直燃烧试验)

Base materials for printed circuits - Part 2 : specification - Specifications number 16 : polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test).

实施日期：2001-04-01

DIN IEC 60326-9-1993

印制电路板.第9部分:带贯穿连接的柔性多层印制电路板要求

Printed boards; part 9: specification for flexible multilayer printed boards with through connections; identical with IEC 60326-9:1991

KS C IEC 61249-2-36-2011(R2016)

Materials for printed boards and other interconnecting structures－Part 2-36：Reinforced base materials clad and unclad－Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

发布日期：2011-07-28  实施日期：2011-07-28

DIN EN 60249-2-1-1994

印制电路的基底材料.第2部分:规范.第1号规范:覆铜箔酚醛纸层压板.高电气质量

Base materials for printed circuits - Part 2: Specifications; specification No. 1: Phenolic cellulose paper copper-clad laminated sheet, high electrical quality (IEC 60249-2-1:1985 + A1:1989 + A2:1993)...

JIS C 6494-1999

Base materials for printed circuits -- Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

发布日期：1999-01-01  实施日期：1999-01-01

KS CIEC 60326-8-2003

Printed boards－Part 8：Specification for single and double sidedflexible printed boards with through connections