BS EN 61249-2-30-2013

印制板和其他互连结构的材料 覆箔和未覆箔基材 规定可燃性的非卤化环氧改性氰酸酯玻璃层压板(垂直燃烧试验)，覆铜

Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability...

发布日期：2013-04-30  实施日期：2013-04-30

IEC 60249-2-2-1985/AMD3-1993

Amendment 3 - Base materials for printed circuits - Part 2: Specifications - Specification No.2: Phenolic cellulose paper copper-clad laminated sheet, economic quality

发布日期：1993-05-13  实施日期：1993-05-13

BS 6221-24-1992

印制线路板.第24部分:照相原图制作指南

Ergaenzende Angaben fuer gedruckte Schaltungen. Anleitung zur Unterlagen-Erstellung Printed Wiring Boards Part 24:Guide for the Production of Artwork (IEC 321-3:1990) Informations complementaires conce...

实施日期：1992-01-01

GOST 29137-1991

Lead forming and electronic component insertion onto PC boards. General requirements and design specifications

GB/T 13556-1992

印制电路用挠性覆铜箔聚酯薄膜

Flexible copper-clad polyester film for printed circuits

发布日期：1992-07-08  实施日期：1993-04-01

IEC 60326-10-1991

印制电路板 第10部分:有贯通连接的刚-扰双面印制电路板规范

Printed boards - Part 10: Specification for flex-rigid double-sided printed boards with through connections

发布日期：1991-03-19  实施日期：1991-03-19

CNS 5760-1980

印刷线路装配之测试点位置

Test Point Locations for Printed Wiring Assemblies

发布日期：1980-07-09  实施日期：1980-07-09

DIN EN 61188-5-3-2008

印制电路板和印制电路板组件 设计和使用 第5-3部分:连接(连接面/接头)考虑事项 两侧带有鸥翼形引线的元件

Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides

实施日期：2008-07-01

KS CIEC 60249-2-3-2002

Base materials for printed circuits－Part 2：Specifications－Specification No.3：Epoxide cellulose paper copper－cladlaminated sheet of defined flammability(vertical burning test)

IEC TR 63018-2015

Flexible printed circuit boards (FPCBs) - Method to decrease signal loss by using noise suppression materials

发布日期：2015-12-16  实施日期：2015-12-16

GB/T 16315-1996

印制电路用限定燃烧性的覆铜箔聚酰亚胺玻璃布层压板

Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits

发布日期：1996-05-20  实施日期：1997-01-01

GB/T 4677.13-1988

印制板金属化孔电阻的变化 热循环测试方法

Test method of change in resistance of plated-through holes-thermal cycling for printed boards

BS EN 61249-3-4-1999

互联结构材料.包被和非包被的非加强基质材料的分规范(用于柔软印制板的).粘胶包被的柔软聚酰亚胺膜

Materialien fuer Leiterplatten und andere Verbindungsstrukturen. Rahmenspezifikation fuer unverstaerkte,kaschierte und unkaschierte Basismaterialien (fuer flexible Leiterplatten). Kleberbeschichtete fl...

实施日期：1999-06-15

BS PD IEC/TR 63017-2015

Flexible printed circuit boards (FPCBs). Method of compensation of impedance variations

发布日期：2016-01-31  实施日期：2016-01-31

NF C93-721-1980

印制电路. 裸置印制电路板的制备

Electronic components. Printed wiring. Rework of printed boards.

实施日期：1980-05-01

NF EN 60249-2-3/A4-2001

印刷电路的基材.第2部分:规范.3号规范.规定易燃性的环氧化合物纤维素纸包铜层压板(垂直燃烧试验)

Base materials for printed circuits - Part 2 : specifications - Specification n o 3 : epoxyde cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test).

实施日期：2001-02-01

DIN EN 61189-6-2007

Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies (IEC 61189-6:2006); German version EN 61189-6:2006

实施日期：2007-03-01

IEC 61189-1-1997/AMD1-2001

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

发布日期：2001-08-09  实施日期：2001-08-09

IEC/PAS 62160-2000

Laminator Qualification Profile

发布日期：2000-08-18  实施日期：2000-08-18

GB/T 12629-1990

限定燃烧性的薄覆铜箔环氧玻璃布层压板(制造多层印制线路板用)

Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

发布日期：1990-12-28  实施日期：1991-10-01