发布日期:2012-08-31 实施日期:2012-08-31
发布日期:2000-08-24 实施日期:2000-08-24
Test methods of the flexural endurance for materials offlexible printed circuits
发布日期:2019-11-11 实施日期:2020-04-01
Base materials for printed circuits - Part 2: Specifications; Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability fo...
发布日期:1990-01-01 实施日期:1990-01-01
发布日期:1993-05-18 实施日期:1993-05-18
发布日期:2011-07-28 实施日期:2011-07-28
Materialien fuer Leiterplatten und andere Verbindungsstrukturen. Kaschierte und unkaschierte verstaerkte Basismaterialien. Kupferkaschierte mit kreuzweise angeordnetem Glasfasergelege verstaerkte Epoxi...
实施日期:2002-05-02
Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
实施日期:2001-09-10
Materials for printed boards and other interconnecting structures - Part 2-19: Reinforced base materials, clad and unclad - Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined ...
发布日期:2001-11-28 实施日期:2001-11-28
发布日期:1989-10-01 实施日期:1989-10-01
Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade,...
实施日期:2005-08-01
Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad; Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced ...
实施日期:2004-01-01
发布日期:1994-05-19 实施日期:1994-05-19
发布日期:2001-11-22 实施日期:2001-11-22
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