IEC TR 60321-1970/AMD1-1975

Amendment 1 - Guidance for the design and use of components intended for mounting on boards with printed wiring and printed circuits

发布日期：1975-01-01  实施日期：1975-01-01

KS CIEC 61188-1-2-2003

Printed boards and printed board assemblies－Design and use－Part 1－2：Generic requirements－Controlled impedance

BS PD IEC/TS 62878-2-3-2015

Device embedded substrate. Guidelines. Design guide

发布日期：2015-04-30  实施日期：2015-04-30

DIN EN 60249-2-1-2000

印制线路基本材料.第2部分:规范:规范1:高电气质量;铜箔复层酚醛树脂胶纸板

Base materials for printed circuits - Part 2: Specifications; specification No. 1: Phenolic cellulose paper copper-clad laminated sheet, high electrical quality

实施日期：2000-12-01

DIN EN 123300 A1-1996

DIN EN 123300-92的修订A1

Sectional specification: Multilayer printed boards; German version EN 123300:1992/A1:1995

UTE C93-706U-1984

Electronic components. Multilayer printed boards. Capability approval detail specifications.

DIN IEC 91/151/CD-1999

IEC 61192-1: Printed board assemblies - Part 1: Generic specification: Workmanship requirements and guidelines for soldered electronic assemblies (IEC 91/151/CD:1998)

DIN EN 61193-3-2013

质量评定体系 第3部分：印刷板、层压最终产品和过程中审核用抽样方案的选择和使用

Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing (IEC 61193-3:2013); German version EN 61193-3:2013

T/CPCA Z5101-2015

印制板特性阻抗时域反射测定指南

Guideline for the determination of characteristic impedance on PCB by TDR

适用范围：本指导性技术文件针对印制电路板（简称印制板，PCB）上传输线特性阻抗时域反射法的测定系统要求、测量仪器及附件要求、测量和校准方法、差分特性阻抗TDR测量和校准方法、测量及校准前准备、校准及测量步骤、注意事项给出了建议...

发布日期：2015-11-01  实施日期：2015-11-01

ASTM F1896-2010

测定印刷导电材料电阻率的试验方法

Test Method for Determining the Electrical Resistivity of a Printed Conductive Material

适用范围：<p>Resistivity is useful to suppliers and manufacturers as follows:</p> <p>when designing membrane switch interface circuitry,</p> <p>when selecting the appropriate conductive material,</p> <p>for cond...

实施日期：2010-05-01

NF C93-753/A1-2001

Base materials for printed circuits - Part 2 : specifications - Specification n o 3 : epoxyde cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test).

ASTM F1294-1997a(2009)

有关自动识别硬拷贝印刷系统的术语

Standard Terminology Relating to Automatic Identification Hard Copy Printing Systems

适用范围：<p id="s00002">1.1 The definitions in this terminology are those that relate directly or indirectly to business imaging hard copy printing used in automatic data-capture systems and the measurement of ...

T/CPCA 4302A-2016

导电银浆

Conductive silver paste

适用范围：本标准规定了导电银浆的性能要求、试验方法、质量保证、包装、运输及贮存等相关要求。 本标准适用于印制电路的连线、贯孔、挠性电路、薄膜开关、连接端口用导电银浆的生产、检验和验收。

发布日期：2016-12-20  实施日期：2017-01-01

GB/T 13555-2017

挠性印制电路用聚酰亚胺薄膜覆铜板

Copper-clad polyimide film laminates for flexible printed circuits

适用范围：本标准规定了挠性印制电路用聚酰亚胺薄膜覆铜板的术语、分类、要求、检验规则、包装、标志、储存及运输等。本标准适用于挠性印制电路用聚酰亚胺薄膜覆铜板(以下简称挠性聚酰亚胺覆铜板)。

发布日期：2017-12-29  实施日期：2019-01-01

IEC 61189-1-1997+AMD1-2001 CSV

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

发布日期：2001-11-22  实施日期：2001-11-22

KS C IEC 61249-2-35-2011(R2016)

Materials for printed boards and other interconnecting structures－Part 2-35：Reinforced base materials, clad and unclad－Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

发布日期：2011-07-28  实施日期：2011-07-28

DIN EN 61249-4-12-2006

印制板和其他互连结构用材料 第4-12部分:非包层预浸渍材料的分规范集 阻燃型非卤化多功能环氧化物编织的E玻璃预浸渍材料

Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepre...

适用范围：This part of IEC 61249 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according IEC 61249-2-7 when manufacturing multilay...

实施日期：2006-03-01

KS CIEC 60249-2-14-2002

Base materials for printed circuits－Part 2：Specifications－No.14：Phenolic cellulose paper copper-clad laminated sheet ofdefined flammability(vertical burning test), economic quality

GB/T 1360-1998

印制电路网格体系

Grid systems for printed circuits

适用范围：本标准规定了印制电路网格体系，以确保印制电路与在其网格交点上安装的元器件之间的一致性。

发布日期：1998-03-20  实施日期：1998-12-01