DIN EN 60747-16-3-2003

半导体器件 第16-3部分:微波集成电路 变频器

Semiconductor devices - Part 16-3: Microwave integrated circuits; Frequency converters

实施日期：2003-02-01

CWA 16374-73-2011

Extensions for Financial Services (XFS) interface specification Release 3.20 - Part 73 : Card Embossing Unit Device Class Interface Migration from Version 3.10 (CWA 15748) to Version 3.20 (this CWA) Programmer's Reference

GB 7087-1986

电子元器件详细规范 半导体集成电路CJ0452型双外围正与非驱动器(可供认证用)

实施日期：1987-10-01

SJ 52438/14-2004

混合集成电路HPA501J型功率放大器详细规范

Hybrid integrated circuits detail specification for type HPA501J power amplifiers

发布日期：2004-08-02  实施日期：2004-12-01

BS EN 62132-8-2012

集成电路 电磁抗扰度的测量 辐射抗扰度测量 集成电路(IC)电介质条状线法

Integrated circuits. Measurement of electromagnetic immunity. Measurement of radiated immunity. IC stripline method

发布日期：2012-10-31  实施日期：2012-10-31

GB/T 15650-1995

半导体集成电路系列和品种 ＣＭＯＳ门阵列电路系列的品种

Series and products for semiconductor integrated circuits Products of series for CMOS gate array

实施日期：1996-04-01

GB 7198-1987

电子元器件详细规范 半导体集成电路CE10102型ECL四2输入或非门(可供认证用)

实施日期：1987-10-01

IEC 60748-2-7-1992

半导体器件 集成电路 第2部分:数字集成电路 第7节:熔丝式可编程双极只读存储器集成电路空白详细规范

Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section seven: Blank detail specification for integrated circuit fusible-link programmable bipolar read-only memories

发布日期：1992-10-23  实施日期：1992-10-23

GB 9427-1988

电子元器件详细规范 半导体集成电路CC4518型CMOS双十进制同步计数器(可供认证用)

实施日期：1989-02-01

UTE C96-112U-1980

Microcircuits. Analog microcircuits. Integrated circuit voltage regulators.

UTE C96-213U-1973

Microcircuits. Digital microcircuits.

KS CIEC 60748-2-2001

半导体元件—集成电器—第2部:数字集成电路

Semiconductor Devices - Integrated Circuits - Part 2: Digital Integrated Circuits

GB/T 6798-1996

半导体集成电路 电压比较器测试方法的基本原理

Semiconductor integrated circuits General principles of measuring methods of voltage comparators

适用范围：本标准规定了半导体集成电路电压比较器(以下简称器件)电特性测试方法的基本原理。　　本标准适用于半导体集成电路电压比较器电特性的测试。

发布日期：1996-07-09  实施日期：1997-01-01

PNS IEC 60748-23-3-2013

半导体器件-集成电路-第23-3部分:混合集成电路和薄膜结构-生产线认证-生产者自审清单和报告（IEC2002年出版）

Semiconductor devices - Integrated circuits - Part 23-3:Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers self-audit checklist and report (IEC published ...

UTE C96-212/A5-1978

IEC 60748-11-1990/AMD1-1995

Amendment 1 - Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits

发布日期：1995-06-06  实施日期：1995-06-06

NF C96-411-1984

混合微型结构 薄膜电阻集成电路（ＣＩＲ） 一般规定

Hybrid microcircuits. Film deposit resistive integrated circuits. General requirements.

实施日期：1984-10-01

DIN IEC 47A(Sec)324-1994

Integrated circuits - Configuration for semiconductor memory circuits (IEC 47A(Secretariat)324:1994)

BS QC 790107-1995

Halbleiterbauelemente. Integrierte Schaltungen. Integrierte Digitalschaltungen. Vordruck fuer Bauartspezifikation fuer integrierte dynamische Schreib-/Lesespeicher Harmonized System of Quality Assessment for Electronic Components Semiconductor Devices-Integrated Circuits:Digital Integrated Circuits Blank Detail Specification Integrated Circuit Dynamic Read/ Write Memories (IEC 748-2-10:1994) (T) Dispositifs a semiconducteurs. Circuits integres. Circuits integres numeriques. Specification particu

实施日期：1995-01-01

BS CECC 63000-1990

电子元器件质量评定协调体系.总规范:薄膜和混合集成电路

Harmonisiertes Guetebestaetigungssystem fuer Bauelement der Electronik. Fachgrundspezifikation:integriete Hybrid und Schichtschaltungen Harmonized system of quality assessment for electronic components...

适用范围：Defines procedures and methods for testing and states requirements for the release of products using either qualification approval or capability approval procedures.

实施日期：1990-12-31