BS CECC 90200-1988

Analogue Monolithic Integrated Circuits:Sectional Specification

实施日期：1988-01-01

GOST 29107-1991

半导体器件 集成电路 第2部分:数字集成电路

Semiconductor devices. Integrated circuits. Part 2. Digital integrated circuits

GB/T 4377-1996

半导体集成电路 电压调整器测试方法的基本原理

Semiconductor integrated circuits--General principles of measuring methods of voltage regulator

适用范围：本标准规定了半导体集成电路电压调整器(以下简称器件)电特性测试方法的基本原理。本标准适用于半导体集成电路电压调整器电特性的测试，不适用于双端(单端口)器件。

发布日期：1996-07-09  实施日期：1997-01-01

GB 7203-1987

电子元器件详细规范 半导体集成电路CE10110型ECL双3输入或门(3输出)(可供认证用)

实施日期：1987-10-01

GB/T 16466-1996

膜集成电路和混合膜集成电路空白详细规范(采用能力批准程序)

Blank detailspecification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures

适用范围：本规范等同采用国际标准IEC 748-22-1/QC 760201（1991）《膜集成电路和混合膜集成电路空白详细规范（采用能力批准程序）》。

发布日期：1996-07-09  实施日期：1997-01-01

UTE C86-222/A2-1986

DIN IEC 47A(Sec)312-1995

Amendment to sectional specification for semiconductor integrated circuits, excluding hybrid circuits (IEC 47A(Sec)312:1993)

BS PD IEC/TR 61967-1-1-2015

Integrated circuits. Measurement of electromagnetic emissions. General conditions and definitions. Near-field scan data exchange format

发布日期：2015-09-30  实施日期：2015-09-30

NF C86-412-1987

Semiconductor devices. Harmonized system of quality assessment for electronic components. Film and hybrid integrated circuits. Blank detail specification.

DIN EN 165000-4-1996

膜和混合集成电路.第4部分:用户信息、产品评定级表和空白详细规范

Film and hybrid integrated circuits - Part 4: Customer information, product assessment level schedules and blank detail specification; German version EN 165000-4:1996

GB 5229-1985

半导体集成电路电视机电路系列和品种

实施日期：1986-04-01

IEC 60747-10-1991/AMD2-1996

Amendment No. 2 to IEC 747-10.

发布日期：1996-02-14  实施日期：1996-02-14

UTE C86-212-1983

Components for electronic equipment. Digital integrated ttl low power schottky circuits. Collection of detail specifications within the scope of the french standard NF C 86-212 (CECC 90 103).

实施日期：1983-11-01

IEC 61967-5-2003

集成电路 150kHz-1GHz电磁辐射的测量 第5部分:传导辐射的测量 工作台静电屏蔽法

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 5: Measurement of conducted emissions - Workbench Faraday Cage method

适用范围：Describes a method to measure the conducted electromagnetic emission of integrated circuits either applied on a standardised test-board or on a final printed circuit board (PCB). Has a high repeatabili...

发布日期：2003-02-13  实施日期：2003-02-13

IEC 60748-23-3-2002

半导体器件 集成电路 第23-3部分:混合集成电路和薄膜结构 生产线认证 制造商的自审清单和报告

Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers'' self-audit checklist and report

适用范围：Applies to a high quality approval system for hybrid integrated circuits and film structures.This checklist is intended for the use of a hybrid microcircuit manufacturer''s internal assessment team. It...

发布日期：2002-05-17  实施日期：2002-05-17

UTE C96-411-1979

Hybrid microcircuits. Film resistive integrated circuits. Relevant article sheets.

实施日期：1979-06-06

GB 7005-1986

电子元器件详细规范 半导体集成电路CT1000型TTL四2输入与非门(可供认证用)

实施日期：1987-07-31

T/JSSIA 0001-2017

倒装芯片球栅阵列封装（FCBGA）系列型谱

Series Programmes for Flip Chip Ball Grid Array Package

适用范围：适用于集成电路倒装芯片球栅阵列封装（FCBGA）

发布日期：2017-09-29  实施日期：2017-10-01

NF C96-111-1976

Microcircuits. Analog microcircuits.

SJ/T 10884-1996

电子元器件详细规范 半导体集成电路CE10131型ECL双主从D触发器(可供认证用)

Detail specification for electronic components--Semiconductor integrated circuit-CE10131 ECL dual type D master-slave flip-flop

实施日期：1997-01-01